Electronic module
US6870746B2 · kind B2 · utility
23Cited by
6References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 6, 2002 |
| Grant date | Mar 22, 2005 |
| Priority date | — |
| Expiry date | Jan 11, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R13/6582
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An electronic module having a configuration for promoting efficient heat dissipation and a circuit board assembly are provided such that when the electronic module is inserted within the circuit board assembly a portion of the electronic module overlaps an EMI shield, with the portion of the electronic module having a configuration for promoting efficient heat dissipation and being external of the EMI shield.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.