Method and apparatus for forming microchannels in a filament wire
US6871523B2 · kind B2 · utility
5Cited by
7References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 31, 2003 |
| Grant date | Mar 29, 2005 |
| Priority date | — |
| Expiry date | Apr 13, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01K3/04
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A microchannel forming device is provided for making microchannels in a wire. The microchannel forming device includes a plurality of dice for receiving a heated wire spaced along a longitudinal axis. Each die has a circumferential surface forming an opening, and teeth projecting normally from the surface and terminating in the opening. As the heated wire is drawn through the opening of each die, the teeth engage the heated wire to form longitudinal microchannels therein.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.