Polymer shrinkage tensometer
US6871550B2 · kind B2 · utility
2Cited by
3References
80Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 14, 2003 |
| Grant date | Mar 29, 2005 |
| Priority date | — |
| Expiry date | Aug 14, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2203/0092
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An apparatus and method for measuring the characteristics of curing polymers. The apparatus and method utilize cantilever beam technology to determine characteristics of polymers during the curing process, including but not limited to, stress-related forces that develop during the polymer curing process. The apparatus and method also provide for controlling and monitoring environmental conditions during the curing process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.