Polishing pad conditioning disks for chemical mechanical polisher
US6872127B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 11, 2002 |
| Grant date | Mar 29, 2005 |
| Priority date | — |
| Expiry date | Jul 11, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B53/12
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The invention relates to disks for conditioning pads used in the chemical mechanical polishing of semiconductor wafers, and a method of fabricating the pads. In one embodiment, the conditioning pad includes multiple, pyramid-shaped, truncated protrusions which are cut or shaped in the surface of a typically stainless steel substrate. Each of the truncated protrusions includes a plateau in the top thereof. A seed layer, typically titanium nitride (TiN), is provided on the surface of the protrusions, and a contact layer such as diamond-like carbon (DLC) or other suitable film is provided over the seed layer. In another embodiment, each of the protrusions is pyramid-shaped and includes a pointed apex at the top thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.