Shower head of a wafer treatment apparatus having a gap controller
US6872258B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 25, 2002 |
| Grant date | Mar 29, 2005 |
| Priority date | — |
| Expiry date | Jun 25, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67017
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A shower head for adjusting distribution of a reactant gas in a process region of a semiconductor manufacturing reaction chamber, wherein a top plate has a gas port for introducing the reactant gas into the reaction chamber; a face plate, having through holes, disposed opposite the process region; a first baffle plate, having through holes, disposed between the top plate and the face plate and capable of moving up or down, wherein the first baffle plate has a top surface that defines a first gap for forming a first lateral flow passage; a second baffle plate, having through holes, disposed between the first baffle plate and the face plate and capable of moving up or down, wherein the second baffle plate has a top surface that defines a second gap for forming a second lateral flow passage; and a gap controller for determining widths of the first and second gaps.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.