Method of molding using compact molding apparatus
US6872353B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Sep 18, 2003 |
| Grant date | Mar 29, 2005 |
| Priority date | — |
| Expiry date | Sep 18, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C2045/1788
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A molding method utilizing a moveable mold platen which may hold, have affixed to, or carry a first portion of a mold or molds. A second or door platen may hold, have affixed to, or carry a second portion of a mold or molds. The door platen is placed in its closed position, and the moveable mold platen is brought up adjacent to it, so that the two portions of the mold are brought into engagement with one another. A desired molding material is injected into the mold cavity, after which the moveable platen is retracted, the door platen is opened, and the part is removed. A part to be encapsulated may be placed into the mold before the two portions of the mold are brought into engagement.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.