Method of forming polycrystalline diamond cutters having modified residual stresses
US6872356B2 · kind B2 · utility
35Cited by
40References
17Claims
0Family size
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Key dates
| Filing date | Nov 15, 2002 |
| Grant date | Mar 29, 2005 |
| Priority date | — |
| Expiry date | Nov 15, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB22F2998/10
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
The residual stresses that are experienced in polycrystalline diamond cutters, which lead to cutter failure, can be effectively modified by selectively thinning the carbide substrate subsequent to high temperature, high pressure (sinter) processing, by selectively varying the material constituents of the carbide substrate, by subjecting the PDC cutter to an annealing process during sintering, by subjecting the formed PDC cutter to a post-process stress relief anneal, or a combination of those means.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.