Shielding device used for various components mounted on circuit board aligned with selectively cut areas
US6873031B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 4, 2002 |
| Grant date | Mar 29, 2005 |
| Priority date | — |
| Expiry date | Mar 4, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/284
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A shielding device is provided in which a layer of deformable electrically conductive material is conformed to fit over the components on the board. In one embodiment of the invention the deformable material is conductive foam, such as metalized foam. One or both sides of the foam layer can be covered with dielectric material. Portions of the dielectric material and foam can be removed, such as from the bottom layer to create insulating slants over the components. Cuts in the deformable material lead to compression only over the component. The board can be placed over the components, which are received in recesses in the shield which are either preformed or result from compression of the deformable material at the location of the components. In one embodiment of the invention, regions of conductive layer are removed and the layer is placed over the components. A top layer is placed thereover. The invention also relates to the method of foaming the board level shield.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.