Encapsulation of polymer based solid state devices with inorganic materials
US6873101B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 1, 2003 |
| Grant date | Mar 29, 2005 |
| Priority date | — |
| Expiry date | Oct 12, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K59/873
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Methods for creating a protective seal suitable for protecting polymer-based electronic devices, including light emitting diodes and polymer emissive displays, are disclosed together with the protected devices. The protective seal includes one or more thin films of silicon nitride (SiN) or other inorganic dielectric applied at low temperature. One or more nonreactive metal layers may be present in the protective layer as well. Other embodiments are disclosed which include a protective cover over the protective layers. These protective layers provide encapsulation with sufficient protection from the atmosphere to enable shelf life and stress life for polymer electronic devices that are adequate for commercial applications.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.