Supplemental heat conduction path for card to chassis heat dissipation
US6873528B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 29, 2002 |
| Grant date | Mar 29, 2005 |
| Priority date | — |
| Expiry date | Mar 13, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20545
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A heat dissipation element which can be shaped as a flat plate for transfer of heat to the opposite side of a mounting channel in a chassis for holding circuit cards. Circuit cards are typically held in place in channels in a chassis by an expansion type retention device. The circuit cards also include a heat frame for collecting the heat produced by the card components and channeling the heat from the card through the heat frame to the chassis. The retention device presses the heat frame in to thermal contact with one side of the channel. The heat dissipation plate is held in thermal contact with the other side of the channel, providing a second additional heat path to channel heat away from individual components, the circuit card and/or the heat frame.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.