Method for manufacturing printed circuit board
US6874675B2 · kind B2 · utility
14Cited by
7References
12Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Jul 9, 2003 |
| Grant date | Apr 5, 2005 |
| Priority date | — |
| Expiry date | Oct 5, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4913
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a printed circuit board includes: washing a land that corresponds to the exposed portion of a copper circuit of a printed circuit board with acidic electrolytic water having a pH of not more than 5 to remove an oxide; treating the land with basic electrolytic water having a pH of not less than 9 to prevent oxidation; and soldering electronic components to the land. The portion to be soldered is treated with the electrolytic water beforehand, thereby improving soldering at low cost without any adverse effect on the environment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.