Patent · US Expired

Method for making a ball and socket joint

US6875388B2 · kind B2 · utility

17Cited by
54References
42Claims
0Family size

Assignee

Inventors

Key dates

Filing dateNov 7, 2001
Grant dateApr 5, 2005
Priority date
Expiry dateMar 22, 2022

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T403/32631
  • WIPO fieldOther special machines
  • WIPO sectorMechanical engineering

Abstract

A molding-in-place technique for joint assemblies, such as a ball joint. The technique is particularly well suited for molding “in-place” a linkage structure about a joint structure. The technique uses a molding assembly having a plurality of centering and sealing structures for sealingly centering the linkage structure about the joint structure. A desired mold material is injected between the linkage structure and the joint structure “in-place” to provide a self-toleranced, self-retained, molded-in-place joint assembly.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.