Positive photosensitive polyimide resin composition
US6875554B2 · kind B2 · utility
43Cited by
3References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 3, 2001 |
| Grant date | Apr 5, 2005 |
| Priority date | — |
| Expiry date | Oct 3, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/0233
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A positive photosensitive polyimide resin composition comprising:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.