System and method for analog replication of microdevices having a desired surface contour
US6875695B2 · kind B2 · utility
3Cited by
11References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 5, 2002 |
| Grant date | Apr 5, 2005 |
| Priority date | — |
| Expiry date | May 20, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C2043/025
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A master wafer is replicated by creating a mold by plating a nickel electroform on a surface of a silicon wafer. Thereafter, a child wafer is prepared with a layer of photoresist or similar material that is compatible with plasma-etching techniques. Thereafter, the mold shape is transferred to the photoresist through compression molding, thereafter the child wafer is etched.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.