Stiction alleviation using passivation layer patterning
US6876046B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 7, 2002 |
| Grant date | Apr 5, 2005 |
| Priority date | — |
| Expiry date | Feb 7, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D1/047
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
The present invention alleviates stiction between a suspended beam or microstructure and an underlying substrate by providing a patterned passivation layer on the substrate underneath the beam. The passivation layer is patterned to provide a substrate surface that differs substantially from the bottom surface of the beam. The difference between these two surfaces reduces the potential contact area between the beam and the substrate when the beam is pulled down, thereby reducing adhesive forces between the beam and the substrate and reducing the likelihood of stiction. In one embodiment, the passivation layer is patterned to form a substrate surface comprising a plurality of protuberances. In another embodiment, the passivation layer is patterned to form a substrate surface having a mesh pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.