MEMS device having contact and standoff bumps and related methods
US6876482B2 · kind B2 · utility
113Cited by
9References
55Claims
0Family size
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Key dates
| Filing date | Nov 8, 2002 |
| Grant date | Apr 5, 2005 |
| Priority date | — |
| Expiry date | Nov 8, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49222
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
MEMS Device Having Contact and Standoff Bumps and Related Methods. According to one embodiment, a movable MEMS component suspended over a substrate is provided. The component can include a structural layer having a movable electrode separated from a substrate by a gap. The component can also include at least one standoff bump attached to the structural layer and extending into the gap for preventing contact of the movable electrode with conductive material when the component moves.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.