Embedded sensor, method for producing, and temperature/strain fiber optic sensing system
US6876785B1 · kind B1 · utility
5Cited by
3References
27Claims
0Family size
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Key dates
| Filing date | Jun 20, 2000 |
| Grant date | Apr 5, 2005 |
| Priority date | — |
| Expiry date | Dec 1, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4206
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for embedding fiber optic sensors in a high melting temperature metal structure produces embedded sensors that are uniformly and closely bonded with the metal and do not slip upon metal expansion and contraction. The structure is built in layers onto the sensor. On top of a first thin sputter-coated metallic layer, approximately 1-3 μm thick, is electroplated a second thin layer, approximately 0.25-2 mm thick. Finally, a metal structure is built around the thin metallic layers by laser cladding, casting, welding, or other method.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.