Fluid-ejection assembly
US6877840B2 · kind B2 · utility
0Cited by
14References
33Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 30, 2003 |
| Grant date | Apr 12, 2005 |
| Priority date | — |
| Expiry date | Jul 23, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/1752
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A fluid-ejection assembly that includes a substantially-rigid substrate and an ejection head configured to be positioned in a fixed relationship relative to the substantially-rigid substrate. The ejection head is configured to eject a fluid based on an ejection signal received via a conductive pattern defined on the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.