Method and apparatus for polishing and planarization
US6878040B2 · kind B2 · utility
1Cited by
8References
18Claims
0Family size
Inventor
Key dates
| Filing date | Aug 30, 2002 |
| Grant date | Apr 12, 2005 |
| Priority date | — |
| Expiry date | Jan 4, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B47/04
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
This invention pertains to methods and apparatus for polishing and planarization of workpieces, such as fiber optics connectors, metallographic samples, semiconductor wafers, microelectronic substrate, optical devices and the like. The polishing pattern is a hypotrochoid generated by a spur gear rotating inside of an internal gear. The hypotrochoid is a superior polishing pattern because it not only provides a pattern similar to a figure eight pattern for producing optimal polishing conditions, but it also appears to precess around the center of the polishing space and maximize the utilization of the polishing pad or film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.