Method for removing a metallic layer of a layer-system

US6878041B2 · kind B2 · utility

Assignee

• Siemens Aktiengesellschaft · DE

Inventors

• Winfried Esser · Bochum, DE
• Ralph Reiche · Berlin, DE

Key dates

• Filing date: Dec 23, 2002
• Grant date: Apr 12, 2005
• Expiry date: Jul 2, 2023

Classification

• Technology area (CPC F): Mechanical Engineering; Lighting; Heating
• CPC primary: F05B2230/80
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

A metallic layer is cooled below room temperature, leading to an embrittlement. Subsequently, the metallic layer is stripped by performing a blasting process having a high efficiency because of the brittleness. Additionally, the substrate is prevented from being damaged by using a comparatively low blasting energy.