One-part solvent-based adhesive for bonding polymer materials
US6878231B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 28, 2003 |
| Grant date | Apr 12, 2005 |
| Priority date | — |
| Expiry date | Feb 28, 2023 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J123/28
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
What is disclosed are adhesives and bonding methods employing a single coat of a solvent-based adhesive that effectively bonds thermoplastic polymers and especially thermoplastic elastomers. The adhesive components are a organosilane component selected from organosilane-isocyanate adduct and isocyanato-organosilane, a post-chlorinated polymer containing propylene repeating units or derivative thereof, and solvent. Also disclosed are methods for joining a rigid, structural substrate to a molten polymer such as a TPE via injection molding or extrusion. Durable adhesion between the adhesive treated portion of the rigid substrate and the melt-processed polymer is achieved with or without a previous heat treatment on the adhesive-coated substrate prior to joining to the thermoplastic melt.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.