Segmented sputtering target and method/apparatus for using same
US6878242B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 8, 2003 |
| Grant date | Apr 12, 2005 |
| Priority date | — |
| Expiry date | Apr 24, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3405
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A rotating sputtering target(s) is segmented so as to include a plurality of different sputtering material portions or segments radially dispersed around the outer periphery of the target. This enables a plurality of different layers to be sputter-deposited, one after the other, using the same sputtering target as the target rotates. The thicknesses of the different layers can be controlled by the radially extensive size of the different segments, the rotation speed of the target, the material sputter rate, the sputtering power used, and/or the line speed of the sputter coater in which the target(s) is located. One or more such targets may be used in a coater according to different embodiments of this invention.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.