Method of polishing wafers
US6878302B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 30, 2000 |
| Grant date | Apr 12, 2005 |
| Priority date | — |
| Expiry date | Mar 30, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B51/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The method comprises the steps of mounting a first wafer (13) on the mounting member (12) and securing the mounting member to the hub (16) by drawing a vacuum at a first vacuum pressure through the hub; rotating the hub about the hub axis (AH), rotating a polishing pad (34) mounted on the turntable (30) about the turntable axis (at), and bringing a surface of the wafer (13) and the polishing pad into contact with each other. The wafer (16) is demounted, and the shape of the polished wafer is determined. A second vacuum pressure is selected using the information obtained. A successive wafer is polished according to the same method as the first wafer except that the second vacuum pressure is substituted for the first vacuum pressure. The second vacuum pressure is sufficient to deform the mounting member (12) thereby deform the wafer to improve the flatness and parallelism of the surfaces of the successive wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.