Stripping method
US6878500B2 · kind B2 · utility
19Cited by
7References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 5, 2003 |
| Grant date | Apr 12, 2005 |
| Priority date | — |
| Expiry date | Apr 5, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/426
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Compositions and methods for the removal of patterned photodefinable materials, such as photoresists and/or photoimageable dielectric materials, from substrates are provided. Such compositions and methods are useful in the manufacture of electronic devices. Methods of reworking electronic device substrates by removing patterned photodefinable material from an underlying organic film are also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.