Patent · US Expired

Vacuum package fabrication of integrated circuit components

US6879035B2 · kind B2 · utility

12Cited by

13References

19Claims

0Family size

Inventors

Athanasios J. Syllaios · Richardson, US
Roland W. Gooch · Dallas, US
Thomas R. Schimert · Ovilla, US

Key dates

Filing date	May 2, 2003
Grant date	Apr 12, 2005
Priority date	—
Expiry date	May 2, 2023

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB81C1/00269
WIPO fieldMicro-structural and nano-technology
WIPO sectorChemistry

Abstract

A method for manufacturing integrated circuit device lids includes creating a lid cavity on the surface of a lid wafer, forming a sealing surface on the lid wafer that surrounds the lid cavity, and forming a trench on the lid wafer between the lid cavity and the sealing surface. The resulting structure uptakes excess sealing surface material and prevents such material from entering the lid cavity.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.