Printed circuit board assembly with multi-channel block-type optical devices packaged therein
US6879423B2 · kind B2 · utility
7Cited by
4References
33Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 22, 2003 |
| Grant date | Apr 12, 2005 |
| Priority date | — |
| Expiry date | Dec 22, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/10253
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present invention discloses an optical printed circuit board assembly with multi-channel block-type optical devices packaged therein, the printed circuit board assembly including a plate type heat spreader, a driving printed circuit board die bonded to a top of the heat spreader to convert electrical and optical signals to optical and electrical signals, respectively, a driving integrated circuit, die bonded to the top of the heat spreader and wire bonded to the driving printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.