Radio frequency module
US6879488B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 25, 2002 |
| Grant date | Apr 12, 2005 |
| Priority date | — |
| Expiry date | Jan 22, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/062
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In a compact radio frequency module, a first chip forms a heater element and a second chip forms a device whose operating characteristics vary with temperature change or whose maximum operating temperature is lower than the maximum operating temperature of the first chip. A multilayer substrate has a plurality of dielectric layers and a plurality of conductor layers and mechanically supports the firs chip and the second chip with some of the conductor layers electrically connected with these chips. The module can conduct the heat generated by the first chip throughout the module; guide the heat generated by the first chip from the module's top face side to its bottom face side; and interrupt the heat conduction from the first conductor pattern on which the first chip is placed to the second conductor pattern on which the second chip is placed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.