Method for determining die placement based on global routing architecture
US6880145B1 · kind B1 · utility
4Cited by
13References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 21, 2001 |
| Grant date | Apr 12, 2005 |
| Priority date | — |
| Expiry date | Apr 4, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F30/3947
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method for interconnecting a plurality of dies. The method generally includes receiving a plurality of interconnect requirements for the dies. The interconnect requirements may include a priority for each of a plurality of nets. A position and an angle for one of the dies relative to a substrate may be calculated in response to the interconnect requirements. A plurality of nets may then be routed among the dies and a plurality of substrate pads defining external connections for the substrate. The dies may be mounted to the substrate after routing has been finalized.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.