Cooling system for an electronic component
US6880345B1 · kind B1 · utility
9Cited by
5References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 4, 2003 |
| Grant date | Apr 19, 2005 |
| Priority date | — |
| Expiry date | Nov 4, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A cooling system for an electronic component is provided. The cooling system includes a plurality of thermoelectric elements for placement above a plurality of different areas of the electronic component. The cooling system has a plurality of conductors connected to the thermoelectric elements for providing current to the thermoelectric elements, such that the thermoelectric elements pump heat away from the respective areas. The cooling system has a control apparatus connected to the conductors for controlling current provided to the thermoelectric elements relative to one another based on heat generated at the different areas.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.