Precision punch and die design and construction
US6880441B1 · kind B1 · utility
1Cited by
10References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 6, 1996 |
| Grant date | Apr 19, 2005 |
| Priority date | — |
| Expiry date | Jun 6, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T83/944
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A precision punch and die device for punching holes in a ceramic substrate and method of assembling the device. The device comprises a punch which moves relative to a substrate for punching a hole in the substrate and a die assembly including one or more precision die plates and support plates for guiding a punch and punching a substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.