Substrate processing apparatus for processing substrates using dense phase gas and sonic waves
US6880560B2 · kind B2 · utility
9Cited by
48References
15Claims
0Family size
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Inventors
Key dates
| Filing date | Nov 18, 2002 |
| Grant date | Apr 19, 2005 |
| Priority date | — |
| Expiry date | Feb 10, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
Embodiments of the invention are directed to substrate processing apparatuses and methods for processing substrates. In one embodiment, a substrate processing apparatus includes a processing chamber, a substrate holder inside of the processing chamber for holding a substrate, and a sonic box in the processing chamber for supplying sonic waves substantially perpendicularly to the substrate. The sonic box may comprises a membrane, and a transducer coupled to the membrane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.