Flux for solder paste
US6881278B2 · kind B2 · utility
22Cited by
10References
32Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 7, 2003 |
| Grant date | Apr 19, 2005 |
| Priority date | — |
| Expiry date | Apr 7, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0266
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A solder powder comprises solder particles having a distribution such that the number of particles having a particle diameter of 20 μm or less is 30% or less, wherein the oxygen content is 500 ppm or less. A flux for solder paste comprises an organic acid component consisting of an organic acid ester and an ester decomposer catalyst, an organic halogen compound, a reducing agent and a resin component. A solder paste mainly comprises a flux and a solder powder, wherein the water content of the solder paste is 0.5% by weight or less.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.