Microelectroforming mold using a preformed metal as the substrate and the fabrication method of the same
US6881369B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 18, 2002 |
| Grant date | Apr 19, 2005 |
| Priority date | — |
| Expiry date | Jan 23, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/00
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The invention discloses a microelectroforming mold using a preformed metal as the substrate and its fabrication method. Using a preformed metal as the substrate can avoid deformation of the microelectroforming mold due to residual stress in the electroforming metal. The fabrication method disclosed herein includes the steps of: forming a layer of bonding material on a surface of the preformed metal substrate after machining; forming a high aspect ratio photoresist microstructure on surfaces of the metal substrate and the bonding material; putting an electroforming material into the gaps of the photoresist microstructure to form an electroforming metal microstructure; and using a thermal process to bond the metal substrate and the metal micro structure by the bonding material and simultaneously bum off the photoresist microstructure to form a micro-electroforming mold. The invention shortens the electroforming time to be one third of the prior art, elongating the number of times the micro-electroforming mold can be used by a factor of more than three.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.