Process for fabricating monolayer/multilayer ultrathin films

US6881444B2 · kind B2 · utility

Inventors

• Jong-Dal Hong · Mainz, DE
• Kook Heon Char · Seoul, KR
• Jin Cho · Palo Alto, US

Key dates

• Filing date: Jan 18, 2002
• Grant date: Apr 19, 2005
• Expiry date: Nov 4, 2022

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02E10/542
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

The present invention provides a process for fabricating ultrathin monolayers or ultrathin multilayer films, the process comprising the steps of: introducing positive or negative charge or a material capable of hydrogen-bonding to a substrate and placing the substrate on a spinner(pretreating step); introducing a material (A) bindable with the material deposited on the substrate, and spinning the substrate at 500 rpm to 30000 rpm for 4 to 200 seconds(first coating step); dropping washing solvent onto the substrate after completion of the first coating and spinning the substrate at 500 rpm to 30000 rpm for 4 to 200 sec to remove weakly-bound material (A) and form a thin film (A)(first washing step); introducing another material (B) bindable with the material (A) coated on the substrate and further coating it in the same condition as of the first coating(second coating step), dropping washing solvent onto the substrate after completion of the second coating and spinning the substrate at 500 rpm to 30000 rpm for 4 to 200 sec to remove the weakly-bound material (B) and form a thin film(B)(second washing step), wherein the entire above steps are more than once repeated.