Laminated resin
US6881460B2 · kind B2 · utility
5Cited by
4References
32Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 13, 2001 |
| Grant date | Apr 19, 2005 |
| Priority date | — |
| Expiry date | Feb 13, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31725
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A multilayer molding having a polyamide-based resin as an outer layer, the multilayer molding including a fluorine-containing resin as an inner layer, as well as a resin laminate which can form the multilayer molding. The resin laminate has a layer (A) including a polyamide-based resin and a layer (B) including a fluorine-containing ethylenic polymer laminated to the layer (A), the polyamide-based resin having an amine value of 10 to 60 equivalents/106 g, and the fluorine-containing ethylenic polymer being a fluorine-containing ethylenic polymer having a carbonyl group.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.