Semiconductor die adapter and method of using
US6881593B2 · kind B2 · utility
3Cited by
14References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 31, 2002 |
| Grant date | Apr 19, 2005 |
| Priority date | — |
| Expiry date | Apr 23, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor die adapter assembly includes a semiconductor die cut from a wafer, the die having an active surface including bond pads. A die adapter, also having bond pads, is bonded to the semiconductor die. Die-to-adapter connectors electrically connect the die bond pads to the adapter bond pads. Finally, adapter-to-substrate connectors electrically connect the adapter bond pads to a device substrate. Having bond pads on the die adapter eliminates the need to break and remake the electrical connections to the original bond pads on the die during burn-in testing of the die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.