Method of making device chips collectively from common material substrate
US6881649B2 · kind B2 · utility
9Cited by
18References
10Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Jan 28, 2003 |
| Grant date | Apr 19, 2005 |
| Priority date | — |
| Expiry date | Oct 23, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S359/90
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A plurality of micromirror chips are collectively made from a common substrate. Each of the micromirror chips is formed with a micromirror unit including a frame, a mirror-forming portion separate from the frame via spaces, and torsion bars connecting the mirror-forming portion to the frame. The common substrate is subjected to etching to provide the spaces and make division grooves for dividing the common substrate into the individual micromirror chips. The etching for the spaces and the etching for the division grooves are performed in parallel with each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.