Resistor substrate with resistor layer and electrode layer and manufacturing method thereof
US6882265B2 · kind B2 · utility
1Cited by
3References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 10, 2003 |
| Grant date | Apr 19, 2005 |
| Priority date | — |
| Expiry date | Jul 10, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01C10/306
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
On a surface of a transfer sheet, a resistor paste is first patterned, and a binder resin thereof is then heat-cured to form resistor layers. Next, an electrode paste containing a binder resin, which has a thermosetting temperature lower than a thermosetting temperature and a glass transition temperature of the binder resin of the resistor layers, is patterned on surfaces of the resistor layers and is then heat-cured, thereby forming electrode layers. By the steps described above, powdered silver contained in the electrode layers is unlikely to ooze into the resistor layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.