Automated product profiling apparatus and product slicing system using same
US6882434B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 20, 2000 |
| Grant date | Apr 19, 2005 |
| Priority date | — |
| Expiry date | Apr 20, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T83/531
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A system, suitable for high-speed operation, by which raw product (45), such as a slab of meat, can be accurately processed, such as by slicing into segments of desired weight, comprises a product profiling apparatus (15). The product profiling apparats (15) meassures the profile of the physical process. The product profiling apparatus (15) includes line lasers (75, 85) for directing a line of light across the upper and lower surfaces of the product (45) and visual image cameras (80, 90) directed toward the profile surface to capture, at fixed increments, the product profile. The product may also be weighed and the product density determined from the overall profile measurements. A controller (150) receives this data, and instructs the physical process accordingly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.