Head suspension having reduced heat deformation
US6882506B2 · kind B2 · utility
28Cited by
7References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 17, 2002 |
| Grant date | Apr 19, 2005 |
| Priority date | — |
| Expiry date | Jul 30, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B5/4833
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A suspension is made of a suspension body of a stainless plate, a resin protective layer on one surface of the suspension body, a circuit pattern including read wiring and write wiring on the protective layer, and a metal layer provided on the other surface of the suspension body. In this arrangement, heat deformation of the suspension is alleviated when a write current is applied.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.