Noncontact ID card and method of manufacturing the same
US6882545B2 · kind B2 · utility
7Cited by
5References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 13, 2003 |
| Grant date | Apr 19, 2005 |
| Priority date | — |
| Expiry date | Apr 24, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06K19/07749
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A noncontact ID card composed by laminating an antenna circuit board where an antenna is formed and an interposer board formed by connecting an enlarged electrode to an electrode of a mounted IC chip and bonding between an antenna electrode of the antenna circuit board and the enlarged electrode of the interposer board with electroconductive adhesive material, wherein a substrate of the antenna circuit board and a substrate of the interposer board are bonded. In addition, in another composition, at least one local deformation is applied to a boding face of the electrodes each other in a direction crossing the bonding face.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.