Waveguide in a printed circuit board and method of forming the same
US6882762B2 · kind B2 · utility
13Cited by
12References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 27, 2001 |
| Grant date | Apr 19, 2005 |
| Priority date | — |
| Expiry date | Feb 22, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09981
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method is provided for forming a waveguide in a printed circuit board. This may include forming a trench in a printed circuit board substrate and forming at least one metalized surface along the trench. A metalized capping surface may be provided over the trench so as to form the waveguide structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.