Spacecraft radiator system using a heat pump
US6883588B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 24, 2000 |
| Grant date | Apr 26, 2005 |
| Priority date | — |
| Expiry date | Jul 24, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02A40/966
- WIPO fieldTransport
- WIPO sectorMechanical engineering
Abstract
Heat dissipating apparatus or system for dissipating heat generated by a payload on a spacecraft having a plurality of surfaces. The system includes at least one radiator-condenser coupled to one or more of the surfaces of the spacecraft and a heat pump including an evaporator, a compressor, and an expansion valve coupled in a closed-loop manner to the radiator-condenser. The system components are coupled together using small diameter, thin- and smooth-walled tubing. The system enables the radiator-condenser to be elevated above the source or payload temperature, and, along with the use of thin walled tubing, reduces the mass of the spacecraft. Because the radiator-condenser temperatures are elevated, multiple surfaces of the spacecraft (west, east, earth and aft) can be effectively used as radiating surfaces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.