Methods and compositions for ink jet printing of pressure sensitive adhesive patterns or films on a wide range of substrates
US6883908B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 8, 2001 |
| Grant date | Apr 26, 2005 |
| Priority date | — |
| Expiry date | Jan 8, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2861
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Methods, systems, and compositions that make it possible to form high resolution, pressure sensitive adhesive patterns or films on a wide range of substrates. The compositions generally incorporate a curable, fluid composition (i.e., pressure sensitive adhesive precursor). When cured, a pressure sensitive adhesive is formed. Ink jet printing and subsequent curing allows pressure sensitive adhesive features to be formed with high resolution and tremendous flexibility in the patterns by which adhesive features may be formed. Preferred embodiments of the invention incorporate rheology modifying agents that can be used to promote favorable dot gain and other printing characteristics, the ability to build print thickness, and mechanical properties of resultant cured adhesives.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.