Low cost package design for fiber coupled optical component
US6883978B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 26, 2003 |
| Grant date | Apr 26, 2005 |
| Priority date | — |
| Expiry date | Jun 26, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/49111
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A fiber-coupled optical component package comprises a high thermal conductivity base, a housing including a ceramic substrate, an optical component mount aperture formed on the substrate and a substantially planar fiber mount region on the substrate adjacent to the optical component mount aperture. An optical component may be secured within an area defined by the optical component mount aperture and an optical fiber may be secured to the substantially planar fiber mount region to optically couple the fiber and the optical component. A package lid may be placed over one or more of the housing, the optical component, and a portion of the fiber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.