Conducive, silicone-based compositions with improved initial adhesion reduced microvoiding
US6884314B2 · kind B2 · utility
21Cited by
3References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 23, 2001 |
| Grant date | Apr 26, 2005 |
| Priority date | — |
| Expiry date | Jun 17, 2021 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K3/013
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates generally to conductive, silicone-based compositions, with improved initial adhesion and reduced micro-voiding. More specifically, the present invention relates to a conductive, silicone-based composition, which includes a polyorganosiloxane, a silicone resin, and a conductive filler component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.