Methods for polishing and/or cleaning copper interconnects and/or film and compositions therefor
US6884338B2 · kind B2 · utility
15Cited by
17References
58Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 16, 2002 |
| Grant date | Apr 26, 2005 |
| Priority date | — |
| Expiry date | Aug 29, 2023 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC11D2111/22
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present invention provides methods of polishing and/or cleaning copper interconnects using bis(perfluoroalkanesulfonyl) imide acids or copper tris(perfluoroalkanesulfonyl) methide acids compositions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.