Patent · US Expired

Molding composition based on polyetheramides

US6884485B2 · kind B2 · utility

33Cited by

7References

17Claims

0Family size

Assignee

Degussa AG · DE

Inventors

Franz-Erich Baumann · Schneverdingen, DE
Martin Himmelmann · Haltern, DE
Wilfried Bartz · Marl, DE
Olivier Farges · Marl, DE

Key dates

Filing date	Jan 21, 2003
Grant date	Apr 26, 2005
Priority date	—
Expiry date	Jan 21, 2023

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/1397
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

A molding composition containing the following components:

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.