Method for manufacturing piezoelectric film, piezoelectric element and ink jet recording head
US6884649B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Sep 22, 2003 |
| Grant date | Apr 26, 2005 |
| Priority date | — |
| Expiry date | Sep 22, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N30/2047
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
The invention provides a method for manufacturing a piezoelectric element including a coating step of coating a substrate with a coating liquid for forming the piezoelectric element thereby forming a coated film, a drying step of drying the coated film, a preliminary sintering step of preliminarily sintering the coated film thereby forming an oxide film, a final sintering step of finally sintering the oxide film thereby forming a piezoelectric film, and a cooling step of cooling the piezoelectric film, wherein the steps are executed in the presence of a moisture-containing gas; in the coating step the substrate has a temperature equal to or less than 50° C. and the moisture-containing gas has a relative humidity of 60% RH or less at 25° C.; in the drying step, the substrate has a temperature equal to or less than 200° C. and the relative humidity is 10 to 70% RH; in the preliminary sintering step the substrate has a temperature of 200 to 450° C. and the relative humidity is 70 to 100% RH; in the final sintering step the substrate has a temperature of 500 to 800° C. and the relative humidity is 70 to 100% RH.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.