Connecting member between wiring films, manufacturing method thereof, and manufacturing method of multilayer wiring substrate
US6884709B2 · kind B2 · utility
26Cited by
13References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 5, 2003 |
| Grant date | Apr 26, 2005 |
| Priority date | — |
| Expiry date | Apr 10, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1572
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A connecting member between wiring films is provided in which: a normal copper foil, which is a general-purpose component and not expensive, or the like can be used as a material; formation of bumps is sufficiently achieved by conducting etching one time; and a necessary number of layers can be laminated and pressed collectively at a time. Bumps, which are formed approximately in a cone-shape, for connecting wiring films of a multilayer wiring substrate are embedded in a second resin film that serves as an interlayer insulating film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.